Reduced contact resistance of new FS silver pastes towards fine line printing and cost reduction - Understanding the Contact Mechanism of FS Ag Pastes. Contacting systems requirements - Reactivity with and removal of the SiNx ARC in the firing temperature range and time frame Capability of forming Ag crystallites and/or colloids Capability of forming thin Ag-silicon interfacial glass films to allow tunnelling contact mechanism High frit reactivity to improve conductor line Ag sintering.