- NexPlanar Secures $10 Million (Views:464, Saved 0 Time(s))
NexPlanar Secures $10 Million for Capacity Expansion of Semiconductor CMP Pad Technology
Oregon capacity to triple; global expansion to quickly follow
Hillsboro, Oregon, March 31, 2011 -- NexPlanar Corporation recently completed a $10.0 million... - ALLVIA to Present Latest Data for Silicon Interposers and Embedded Capacitors at Packaging Forum (Views:398, Saved 0 Time(s))
Sunnyvale, California, March 2, 2011 -- ALLVIA, the first through-silicon via (TSV) foundry, will present its latest analysis on silicon interposers and embedded capacitors during the IMAPS Conference on Device Packaging in Scottsdale, AZ, March 9. Dr. Se... - CMP Pad Technology Company NexPlanar to Open New Manufacturing Site in Oregon (Views:516, Saved 0 Time(s))
Semiconductor CMP Pad Technology Company NexPlanar to Open New Manufacturing Site in Oregon.
New manufacturing jobs to be added; benefits of Oregon manufacturing expansion include talent pool and proximity to customers.
Hillsboro, OR, December 17,... - Fabless to Fab - MEMS Company IntelliSense and Refurbished Supplier ClassOne Build China Fab (Views:426, Saved 0 Time(s))
Fabless MEMS company IntelliSense builds new fab in Nanjing, China, with refurbished equipment from ClassOne. New partnership will expand business in China market for both companies.
Nanjing, China, June 22, 2010
MEMS design and development comp... - Allvia Integrates Embedded Capacitors for Silicon Interposers (Views:699, Saved 0 Time(s))
3D Integration Breakthrough - ALLVIA Integrates Embedded Capacitors for Silicon Interposers and 3D Stacked Semiconductors
ALLVIA TSVs help integrate passive elements directly onto the silicon substrate in much higher densities
Sunnyvale,... - Semiconductor CMP Pad Company NexPlanar Opens Office in Taiwan (Views:588, Saved 0 Time(s))
Semiconductor CMP Pad Technology Company NexPlanar Opens Representative Office in Taiwan
Hillsboro, Oregon, January 18, 2010
In response to growing business activity in Taiwan and in South East Asia, NexPlanar has established a representative... - First Through-Silicon Via Foundry, Allvia, Acquires Manufacturing Site in Oregon (Views:810, Saved 0 Time(s))
Semiconductor equipment tool selection process to begin shortly; benefits of Oregon manufacturing expansion include talent pool and lower operating costs
Sunnyvale, California, Oct. 22, 2009
ALLVIA, the first through-silicon via (TSV) foundry, has ... - For Through-Silicon Vias and Wafer Bonding, Shin-Etsu Introduces New Dry Film Photoresist (Views:1156, Saved 0 Time(s))
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For Semiconductor Wafer Bonding and Through-Silicon Via Applications, Shin-Etsu MicroSi Introduces New Dry Film Dielectric Photoresist
Vacuum laminated dry films for 3D TSVs flow into vias for void free, planar... - First Through-Silicon Via Foundry, ALLVIA, Selects SunSil for Semiconductor Sales and Marketing (Views:762, Saved 0 Time(s))
Recent through-silicon via (TSV) work with interposers and new funding spark ALLVIA’s expansion
Sunnyvale, California, July 7, 2009
ALLVIA, the first through-silicon via (TSV) foundry, has hired SunSil Inc. to sell and market th... - For Semiconductor Advanced Packaging Bump Processing, Shin-Etsu Chemical Has Introduced Ultra Thick Photoresist - SIPR-7126 (Views:736, Saved 0 Time(s))
For thick plating applications like copper pillar bump processing in semiconductor advanced packaging, Shin-Etsu has introduced a positive tone, chemically amplified ultra thick photoresist, SIPR-7126. The photoresist was developed to plate high aspect ... - Some Good News! - Investment in the First Through-Silicon Via Foundry, ALLVIA, Grows to $25 Million with Next Round of Funding (Views:565, Saved 0 Time(s))
Sunnyvale, California, February 4, 2009
ALLVIA, the first through-silicon via (TSV) foundry, has secured $5 million from private investors in its next round of funding to expand manufacturing facilities and to build more capacity. This brings ... - DuPont Expands WLP Solutions (Views:1012, Saved 1 Time(s))
DuPont Electronic Technologies Expands Wafer Level Packaging Solutions
New Emphasis Strengthens Portfolio and Product Development for Emerging 3D/TSV Applications
RESEARCH TRIANGLE PARK, N.C., Sept. 23, 2008 — DuPont Electronic Techn... - DuPont Introduces Kalrez to PV Market (Views:838, Saved 0 Time(s))
FOR IMMEDIATE RELEASE Contact: Nancy Harton
&... - As MES Server Obsolescence Hits Semiconductor Fabs, CIMAC Introduces New Packaged Service Solution for MES Migration (Views:706, Saved 0 Time(s))
As MES Server Obsolescence Hits Semiconductor Fabs, CIMAC Introduces New Packaged Service Solution for MES Migration
Hewlett Packard has announced dates when support for their legacy server platforms will no longer be available; IT departments... - DuPont Air Products NanoMaterials Pleased with Ruling in Patent Case Against Cabot (Views:824, Saved 0 Time(s))
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DuPont Air Products NanoMaterials LLC Pleased with Interim Ruling in Patent Infringement Case Against Cabot Microelectronics
Tempe, Ariz., (August 21, 2008)— DuPont Air Products NanoMaterials L.L.C....
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