- NOVELLUS’ PETER WOLTERS SUBSIDIARY INTRODUCES INNOVATIVE GAP MEASUREMENT TECHNOLOGY FOR DOUBLE-SIDE (Views:562, Saved 0 Time(s))
Novellus Systems (NASDAQ: NVLS) today announced that its German subsidiary Peter Wolters GmbH has introduced innovative gap measurement technology for double-side silicon prime wafer polishing (DSP). The new high resolution sensors and software algorithms... - NOVELLUS INTRODUCES VECTOR EXCEL – A MODULAR PLATFORM FOR ADVANCED DIELECTRICS THAT REQUIRE PRE- AND (Views:527, Saved 0 Time(s))
Press Release
NOVELLUS INTRODUCES VECTOR EXCEL – A MODULAR PLATFORM FOR ADVANCED DIELECTRICS THAT REQUIRE PRE- AND POST-PROCESSING
New System for Sub-28 nm Dielectric Films Utilizes Innovative
Interface Engineering to Reduce RC Delay Without C... - Nefsis Announces Free Version of Its High-Quality Online Video Conferencing Service, Including Web C (Views:669, Saved 0 Time(s))
Nefsis Announces Free Version of Its High-Quality Online Video Conferencing Service, Including Web Collaboration and VoIP
Nefsis Basic Bridges the Gap Between Simple Web Conferencing and High-Quality Video Conferencing, Delivering Ideal Producti... - NOVELLUS INTRODUCES CONFORMAL FILM DEPOSITION TECHNOLOGY FOR SUB-32NM FRONT-END-OF-LINE AND DOUBLE P (Views:405, Saved 0 Time(s))
News Release
NOVELLUS INTRODUCES CONFORMAL FILM DEPOSITION TECHNOLOGY FOR SUB-32NM FRONT-END-OF-LINE AND DOUBLE PATTERNING APPLICATIONS
Dielectric films deposited on the VECTOR® platform demonstrate
ALD-like step c... - GE Lighting and Rambus Sign License Agreement to Create LED Lighting Solutions for Global Markets (Views:740, Saved 0 Time(s))
CLEVELAND & LOS ALTOS, Calif.--(BUSINESS WIRE)--LED (light emitting diodes) lighting solutions are taking center stage as interest and demand grow for energy-efficient lighting innovations and as governments around the world enact stri... - NOVELLUS’ NEW TUNGSTEN NITRIDE (WN) PROCESS ENABLES ADVANCED COPPER INTERCONNECTS FOR 3Xnm MEMORY DE (Views:463, Saved 0 Time(s))
Novellus’ NEW TUNGSTEN NITRIDE (WN) PROCESS enables advanced copper interconnects for 3Xnm memory devices and beyond
ALTUS® DirectFill™ Liner-Barrier Technology Results in 30 Percent Lower Via Resistance
San Jose, Califor... - NOVELLUS DEVELOPS PRECISION ANTI-REFLECTIVE LAYERS THAT ENABLE CRITICAL DIMENSION CONTROL STRATEGIES (Views:376, Saved 0 Time(s))
New VECTOR® PECVD Process Deposits Patterning Layers With
4X Less Wafer-To-Wafer Variability As Compared To Single Station Deposition Architectures
San Jose, California -- April 22, 2010 – Novellus Systems (NASDAQ: NVLS) announced tod... - PETER WOLTERS’ INNOVATIVE SILICON WAFER GRINDING TECHNOLOGY PRODUCES 5X FLATTER WAFERS GRINDING T (Views:561, Saved 0 Time(s))
RENDSBURG, Germany – March 31, 2010 – Peter Wolters GmbH, a leading manufacturer of high-precision machine tools and a wholly owned subsidiary of Novellus Systems (NASDAQ: NVLS) today announced that it has developed innov... - NOVELLUS SYSTEMS ANNOUNCES JOINT DEVELOPMENT PROGRAM ON COPPER THROUGH-SILICON-VIA (TSV) FOR 3-D SE (Views:493, Saved 0 Time(s))
Type or Copy and Past
San Jose, California – March 17, 2010 – Novellus Systems (NASDAQ: NVLS) today announced the establishment of a joint development program (JDP) with the IBM Corporation (NYSE: IBM) to design a manufacturing-worthy, copper... - Lighting and Display Industry Leaders Join Rambus (Views:504, Saved 0 Time(s))
LOS ALTOS, Calif.--(
BUSINESS WIRE
)--
Rambus Inc.
(NASDAQ: RMBS), one of the world’s premier technology licensing companies, today announced that Dr. Kieran Drain and Mr. Marc McConnaughey have joined as vice presidents of... - NOVELLUS DEVELOPS ADVANCED COPPER SEED TECHNOLOGY FOR THROUGH-SILICON-VIA (TSV) PACKAGING (Views:570, Saved 0 Time(s))
Press Release
Novellus DEVELOPS ADVANCED COPPER SEED TECHNOLOGY
FOR THROUGH-SILICON-VIA (TSV) PACKAGING
New PVD HCM® Process Enables Void-free Copper Fill
Of High Aspect Ratio TSV Structures
San Jose, California –... - Rambus Unveils Mobile XDR™ Memory for Next-Generation Mobile Products (Views:544, Saved 0 Time(s))
Type or Copy and P
High-Bandwidth, Low-Power and Cost-Effective Solution Delivers Strong Consumer Benefits
LOS ALTOS, Calif., Feb 8, 2010, -- Rambus Inc. (NASDAQ: RMBS), one of the world’s premier technology licensing companies, today unve... - NOVELLUS SYSTEMS SHIPS 1000TH VECTOR® PECVD SYSTEM (Views:621, Saved 0 Time(s))
Industry-leading Dielectric Deposition System Accepted by GLOBALFOUNDRIES
for High-volume Manufacturing
San Jose, California – February 1, 2010 – Novellus Systems (NASDAQ: NVLS) today announced that it has... - NOVELLUS SYSTEMS LAUNCHES SOLA® xT UVTP SYSTEM FOR SUB-45nm HIGH VOLUME MANUFACTURING (Views:464, Saved 0 Time(s))
Flexible Multistation Sequential Processing (MSSP) Architecture Delivers
ULK Films With 25 Percent Hardness Improvement over Competitive Approach
San Jose, California – January 13, 2010 – Novellus Systems (NASDAQ: NV... - NOVELLUS SYSTEMS LAUNCHES SOLA® xT UVTP SYSTEM FOR SUB-45nm HIGH VOLUME MANUFACTURING (Views:475, Saved 0 Time(s))
Flexible Multistation Sequential Processing (MSSP) Architecture Delivers
ULK Films With 25 Percent Hardness Improvement over Competitive Approach
San Jose, California – January 13, 2010 – Novellus Syste...
|
| weSRCH being a unique site exclusively designed for high-end professionals looks forward towards bridging the gap between real and virtual world. Enabling social interaction with various other scientists, doctors, engineers, and colleagues in your field, weSRCH keeps you abreast of latest ongoing in the field of High-tech, Green-tech, Medicine and Business. Register free to be a member! |
